Engineering_Rom_Poco_M3_Pro_(5G)___Redmi_Note_10_5G_(camellian).rar

Engineering Rom Poco M3 Pro (5G)   Redmi Note 10 5G (camellian) Firmware BY firmware.gem-flash.com 
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Content Of File:

AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\auth_sv5.auth
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\flash_all.bat
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\flash_all.sh
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\flash_all_except_data_storage.bat
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\flash_all_except_data_storage.sh
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\flash_all_lock.bat
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\flash_all_lock.sh
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\flash_gen_md5_list.py
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\hat_extract.py
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\hat_flash.sh
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\boot-debug.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\boot.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\Checksum.ini
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\crclist.txt
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\cust.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\dpm-verified.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\dpm.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\dtb.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\dtbo-verified.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\dtbo.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\efuse.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\gz-verified.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\gz.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\lk-verified.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\lk.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\logo-verified.bin
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\logo.bin
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\mcupm-verified.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\mcupm.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\md1arm7.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\md1img-verified.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\md1img.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\md3img.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\MI_FFU\ffu_list.txt
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\MI_FFU\MICRON_LYRA2_64GB_0605.bin
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\MI_FFU\S101_64G_430bda1ae4_MICRON.bin
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\MI_FFU\S201_64G_dd6e035122_MICRON.bin
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\MT6833_Android_scatter.txt
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\pi_img-verified.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\pi_img.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\preloader.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\preloader_camellia.bin
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\preloader_emmc.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\preloader_raw.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\preloader_ufs.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\product.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\provision.xml
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\ramdisk-debug.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\ramdisk-recovery.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\ramdisk.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\rescue.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\scp-verified.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\scp.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\secro.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\sparsecrclist.txt
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\spmfw-verified.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\spmfw.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\sspm-verified.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\sspm.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\super.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\super_empty.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\system.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\system_other.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\tee-verified.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\tee.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\userdata.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\vbmeta.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\vbmeta_system.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\vbmeta_vendor.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\vendor.img
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\MTK_AllInOne_DA.bin
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\SLA_Challenge.dll
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images\MI_FFU
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC\images
AN3516_762__MIdev_MP_patchbuild_20210625140701_factorySign_DCC
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Total file size is 4401 MB and has compressed to 1462 MB to save bandwidth for download 
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