Bond L34C 8.0.0.332 C567CUSTC567D1 Firmware Android 8.0.0 EMUI 8.0.0 05014XEA Firmware BY firmware.gem-flash.com
Bond L34C 8.0.0.332 C567CUSTC567D1 Firmware Android 8.0.0 EMUI 8.0.0 05014XEA Firmware BY firmware.gem-flash.com ------------------------------------------- Content Of File: Software\SDupdate_Package.tar.gz Software\dload\BND-L34_hw_usa\update_sd_BND-L34_hw_usa.zip Software\dload\update_sd.zip ReleaseDoc\Bond-L34C 8.0.0.332(C567CUSTC567D1) Virus Scan Report.doc ReleaseDoc\HUAWEI Bond-L34C 8.0.0.332(C567CUSTC567D1) VDD_汾ļױ.doc ReleaseDoc\HUAWEI Bond-L34C 8.0.0.332(C567CUSTC567D1)Release Notes.txt ReleaseDoc\Open Source Software Notice.pdf ReleaseDoc\HUAWEI BND-L34 8.0.0.332(C567) Release_Notes.docx ReleaseDoc\HUAWEI Bond-L34C 8.0.0.332(C567CUSTC567D1) SDָ_.docx ReleaseDoc\HUAWEI Bond-L34C 8.0.0.332(C567CUSTC567D1) SDָ_÷.docx ReleaseDoc\HUAWEI Bond-L34C 8.0.0.332(C567CUSTC567D1) Software Upgrade Guideline.docx ReleaseDoc\Bond-L34C 8.0.0.332(C567CUSTC567D1)-TA.PNG ------------------------------------------- Total file size is 4856 MB and has compressed to 4828 MB to save bandwidth for download -------------------------------------------