Bond TL10BBND TL10 8.0.0.356 C01 FirmwareAndroid 8.0.0 EMUI 8.0.0 05015FAS Firmware BY firmware.gem-flash.com
Bond TL10BBND TL10 8.0.0.356 C01 FirmwareAndroid 8.0.0 EMUI 8.0.0 05015FAS Firmware BY firmware.gem-flash.com ------------------------------------------- Content Of File: Software\SDupdate_Package.tar.gz Software\dload\BND-TL10_cmcc_cn\update_sd_BND-TL10_cmcc_cn.zip Software\dload\update_sd.zip ReleaseDoc\HUAWEI Bond-TL10 8.0.0.355(C01) ReleaseNotes.txt ReleaseDoc\Bond_ģԤ_MMIԼ.xls ReleaseDoc\HUAWEI Bond-TL10 8.0.0.356(C01) ReleaseNotes.txt ReleaseDoc\Bond-TL10 8.0.0.356(C01) й-EMUI8.0-汾˵_v2.1.docx ReleaseDoc\HONOR BND-TL10 8.0.0.356(C01) SDָ-.docx ReleaseDoc\HONOR BND-TL10 8.0.0.356(C01) SDָ-÷.docx ReleaseDoc\HONOR BND-TL10 8.0.0.356(C01) 汾ļͰ汾ױ.docx ReleaseDoc\HUAWEI BND-EMUI8.0.0˵EMUI5.1ָ̳v1.0.docx ReleaseDoc\MMI2ԲԲָ߲v1.2.docx ReleaseDoc\Open Source Software Notice .pdf ReleaseDoc\Bond-TL10B 8.0.0.356(C01) Virus Scan Report.doc ------------------------------------------- Total file size is 6229 MB and has compressed to 6199 MB to save bandwidth for download -------------------------------------------