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Bond-L22B Firmware Go Back

Bond_L22B_8.0.0.365_C675CUSTC675D1_Firmware_8.0.0_r1_EMUI8.0_05014VKW_update_sd.rar

Featured

[ Model Name: Huawei Honor 7X Bond-L22B Firmware ] [ Model Code: Bond_L22B ] [ OS Version: Android Oreo v8.0.0 ]

Date 2019-02-04 16:58:07
Filesize 1.92 GB
Visits 57

 

 

Download

[ Model Name: Huawei Honor 7X Bond-L22B Firmware ]
[ Model Code: Bond_L22B ]
[ OS Version: Android Oreo v8.0.0 ]

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Content Of File:
More_Flash_File.url
ReleaseDoc\Bond-L22B_8.0.0.365(C675)_hw_in_Version_VDD__AEI_IIx.doc
ReleaseDoc\Bond-L22B_8.0.0.365(C675CUSTC675D1)_hw_in_Equipment_Calibration_MC_x,DDI.xls
ReleaseDoc\Bond-L22B_8.0.0.365(C675CUSTC675D1)_hw_in_Software_Release_Notes__EAE.docx
ReleaseDoc\Bond-L22B_8.0.0.365(C675CUSTC675D1)_hw_in_Software_UG_E_y,E.docx
ReleaseDoc\Bond-L22B_8.0.0.365(C675CUSTC675D1)_Virus_Scan_Report.doc
ReleaseDoc\Bond-L22B_8.0.0.365(C675CUSTC675D1)__hw_in_PS_Use_case_3OAAy.xlsx
ReleaseDoc\Open_Source_Software_Notice.pdf
Software\dload\update_sd.zip
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Total file size is 1804 MB and has compressed to 1783 MB to save bandwidth for download